PackDesign, Complete CAD Solutions for the Die- and Packaging Industry
Submitted by BCSI Systems on Fri, 11/27/2009 - 19:59
About PackDesign, PackDesign is a fully integrated open and modular Windows based 3D and 2D Cad/Cam platform for the packaging and die making industry. The various modules are configurable and tunable as add-ons. Some modules are also available as standalone applications.
About BCSI, BCSI Systems BV has been founded in 1989 as a system house dedicated to the packaging and die making industry. Since then the company continues at the heart of revolutions in computing and automatization dedicated to this industry.
Today, BCSI is a well established company in the Netherlands and Spain. Besides there are representations and agents active for BCSI all over the world.
Please visit our website for more information: www.bcsi-systems.com
